| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film and a tape for wafer processing, capable of eliminating residual void by normal-pressure heating without using expensive facilities, such as a pressurizing oven, and of obtaining a package in which thinned chips are multistage-laminated at a low cost.SOLUTION: Provided are an adhesive film 13 and a tape 10 for wafer processing. The adhesive film 13 has an adhesive agent layer 13b adhered to a semiconductor wafer. The adhesive agent layer 13b includes a phenoxy resin and an epoxy resin as an essential component. A loss tangent (tanδ) of the adhesive agent layer before hardening, that is measured in a range of 40-200°C on conditions that a frequency is 1 Hz, a temperature rising rate is 20°C/minute, and a distortion amount is 0.3%, is 1.0 or more in a temperature range of 10 K or more that is continuous at least in a range of 60-180°C. The minimum value of a complex viscosity (&eegr;) of the adhesive agent layer 13b before hardening, that is measured in a range of 60-180°C on the above conditions is 300 Pa s or more and less than 10,000 Pa s. |
