| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board, capable of preventing cracks of a wiring due to deformation caused by heat distortion of a resin filling material, when a chip component is built in the wiring board. <P>SOLUTION: This wiring board 10 includes: a core material 11 placing a semiconductor chip 200 and having a housing hole opened thereon; first and second wiring multilayer portions 12, 13 formed on the top and bottom of the core material 11; a chip capacitor 100 as a chip component housed in the housing hole; and a resin filling material 50 filled in a gap between the housing hole and the side surfaces of the chip capacitor 100. On the upper surface of the core material 11, a filling region of the resin filling material 50 faces a region where the semiconductor chip 200 is placed in a multilayer direction, and on the lower surface side of the core material 11, a wiring is not formed on the region facing the region where the resin-filling material 50 is formed in the multilayer direction, of a conductor layer of a second wiring multilayer portion 13. Accordingly, the disadvantages such as cracks in the wiring portion of the conductor layer of the wiring substrate 10 due to deformation caused by the heat distortion of the resin-filling material 50 can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
