发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a patterning method of a chromium film which does not include wet etching treatment process and does not need an exclusive treatment equipment for chlorine gas and enables treatment in an inexpensive device configuration. <P>SOLUTION: The patterning method is constituted so as to have: a chromium film formation process of forming a chromium film 11' on a base 10; a mask material film formation process of forming a mask material film 12', which is not removed on oxygen plasma condition in the following patterning process, on the chromium film 11'; a mask pattern formation process of forming a predetermined mask pattern 12 by patterning the mask material film 12'; a patterning process of heating a stage for film placement to a temperature range of oxygen plasma condition and exposing a part of the chromium film, in which the mask pattern 12 is not formed, to oxygen plasma which does not contain chlorine atom for sublimating and removing it as a chrome oxide. Thereby, a predetermined chromium pattern 11 is obtained. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP5282512(B2) 申请公布日期 2013.09.04
申请号 JP20080252385 申请日期 2008.09.30
申请人 发明人
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
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