发明名称 |
Chip with sintered connections to package |
摘要 |
A microelectronic package and method of making same are provided. The package includes a substrate having first and second opposed surfaces, an edge surface extending therebetween, a plurality of terminals, and a plurality of conductive elements electrically connected with the terminals. The edge surface can be disposed at a periphery of the substrate or can be the edge surface of an aperture within the substrate. A microelectronic element has a front face and contacts thereon, with at least some of the contacts being adjacent to the edge surface of the substrate. A dielectric material overlies the edge surface of the substrate and defines a sloping surface between the front face of the microelectronic element and the substrate. A conductive matrix material defines a plurality of conductive interconnects extending along the sloping surface. The conductive interconnects electrically interconnect respective ones of the contacts with the conductive elements.
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申请公布号 |
US8525338(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US201113154778 |
申请日期 |
2011.06.07 |
申请人 |
SATO HIROAKI;HASHIMOTO KIYOAKI;NAKADAIRA YOSHIKUNI;MASUDA NORIHITO;HABA BELGACEM;MOHAMMED ILYAS;DAMBERG PHILIP;TESSERA, INC. |
发明人 |
SATO HIROAKI;HASHIMOTO KIYOAKI;NAKADAIRA YOSHIKUNI;MASUDA NORIHITO;HABA BELGACEM;MOHAMMED ILYAS;DAMBERG PHILIP |
分类号 |
H01L23/48;H01L21/00;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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