发明名称 |
Flip-chip QFN structure using etched lead frame |
摘要 |
A microelectronic unit can include a lead frame and a device chip. The lead frame can have a plurality of monolithic lead fingers extending in a plane of the lead frame. Each lead finger can have a fan-out portion and a chip connection portion extending in the lead frame plane. The fan-out portions can have first and second opposed surfaces and a first thickness in a first direction between the opposed surfaces. The chip connection portions can have a second thickness smaller than the first thickness. The chip connection portions can define a recess below the first surface. The device chip can have a plurality of at least one of passive devices or active devices. The device chip can have contacts thereon facing the chip connection portions and electrically coupled thereto. At least a portion of a thickness of the device chip can extend within the recess. |
申请公布号 |
US8525309(B2) |
申请公布日期 |
2013.09.03 |
申请号 |
US201113173883 |
申请日期 |
2011.06.30 |
申请人 |
CHIA CHOK;LOW QWAI;DESAI KISHOR;WOYCHIK CHARLES G.;TESSERA, INC. |
发明人 |
CHIA CHOK;LOW QWAI;DESAI KISHOR;WOYCHIK CHARLES G. |
分类号 |
H01L23/495;H01L21/50;H01L21/60;H01L23/34;H01R43/16 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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