发明名称 Semiconductor device and method for manufacturing same
摘要 There are provided a semiconductor device that includes a bypass protection unit against surge voltage or the like, achieves good withstand voltage characteristics and low on-resistance (low On-state voltage), has a simple structure, and is used for large-current purpose and a method for producing the semiconductor device. In the present invention, the semiconductor device includes an n+-type GaN substrate 1 having a GaN layer that is in ohmic contact with a supporting substrate, a FET having an n--type GaN drift layer 2 in a first region R1, and an SBD having an anode electrode in a second region R2, the anode electrode being in Schottky contact with the d--type GaN drift layer 2. The FET and the SBD are arranged in parallel. A drain electrode D of the FET and a cathode electrode C of the SBD are formed on the back of the n+-type GaN substrate 1.
申请公布号 US8525184(B2) 申请公布日期 2013.09.03
申请号 US201213531279 申请日期 2012.06.22
申请人 OKADA MASAYA;KIYAMA MAKATO;YAEGASHI SEIJI;NAKATA KEN;SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. 发明人 OKADA MASAYA;KIYAMA MAKATO;YAEGASHI SEIJI;NAKATA KEN
分类号 H01L29/15 主分类号 H01L29/15
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