| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which can improve the junction between semiconductor chip electrodes and connection members and a semiconductor device manufacturing method using the apparatus.SOLUTION: The semiconductor manufacturing apparatus comprises a bonding stage 12 on which a semiconductor chip 31 having an electrode 33 is mounted, a capillary for joining copper wire which is the connection member of a first member to the electrode 33, a load supply unit for applying load to the capillary, and a film deposition unit 40 for depositing gold which is a second member different from the first member to a ball surface formed at the tip of the connection member. The semiconductor device manufacturing method includes a step of forming a ball at the tip of the connection member of the first material, a step of depositing the second member on the ball surface, and a bonding step of bonding the ball having the second member formed on its surface to the electrode 33 of the semiconductor chip 31. |
