| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method without delamination in an ink jet printhead configured by connecting two materials.SOLUTION: A method for assembling a printhead can include a step of using an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. |
