发明名称 WIRING BOARD AND LIGHT EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an insulation substrate and a light emitting device which achieve a high reflection rate of light emitted from a light emitting element mounted thereon.SOLUTION: A wiring board 10 includes: an insulation substrate 1 having an upper surface including mounting parts 1a of a light emitting element; and multiple wiring conductors 2 respectively provided at the mounting parts 1a. The insulation substrate 1 includes recessed parts 4 between the multiple wiring conductors 2 in the mounting parts 1a and light reflection layers 5 are respectively provided at bottom parts of the recessed parts 4. The reflection rate is improved by the reflection layers 5. Further, the reflection layer 5 is positioned at the bottom part of each recessed part 4 and thus electric insulation is easily secured between the adjacent wiring conductors 2.
申请公布号 JP2013172002(A) 申请公布日期 2013.09.02
申请号 JP20120035154 申请日期 2012.02.21
申请人 KYOCERA CORP 发明人 HORINOUCHI NAOKI
分类号 H01L33/62;H01L33/60 主分类号 H01L33/62
代理机构 代理人
主权项
地址
您可能感兴趣的专利