| 摘要 |
PURPOSE: A flip chip bonding device is provided to minimize the transfer path of a flip chip by arranging a flip chip supply part, a flux dipping part, and a flip chip bonding part on the linear transfer path of a bonding head part. CONSTITUTION: A bonding head part (300) bonds a flip chip to a flip chip bonding part. A transfer part (600) mounts the bonding head part. A chip vision unit photographs the lower surface of the flip chip dipped in a flux dipping part. The transfer path of the transfer part moving the bonding head part is a straight line. A flip chip supply part (200), the flux dipping part, the chip vision unit, and the flip chip bonding part are successively arranged in the lower part of the transfer path. |
