发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, which enables formation of resin patterns with a large difference of height when resin patterns having different heights are simultaneously formed on the same substrate by use of a halftone mask.SOLUTION: The photosensitive resin composition comprises the following (A), (B), (C) and (D). They are: (A) a copolymer having a structural unit derived from at least one compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a structural unit derived from a monomer having a 2-4C cyclic ether structure and an ethylenically unsaturated bond; (B) a polymerizable compound; (C) a polymerization initiator including an oxime compound, in which the content of the oxime compound is 30 mass% or more and 100 mass% or less with respect to the whole amount of the polymerization initiator; and (D) a compound expressed by formula (1). In formula (1), Rrepresents an alkyl group having 1 to 6 carbon atoms; and Ato Aeach independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
申请公布号 JP2013171278(A) 申请公布日期 2013.09.02
申请号 JP20120037244 申请日期 2012.02.23
申请人 SUMITOMO CHEMICAL CO LTD 发明人 INOUE KATSUJI
分类号 G03F7/004;C07C43/23;C07C321/30;C07D209/86;C07D295/04;C08F220/00;C08F220/26;C08G59/02;G03F7/031;G03F7/033 主分类号 G03F7/004
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