发明名称 PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To suppress deformation of a package due to screwing.SOLUTION: A package 10 for housing an electronic component includes an enclosure 1 which is polygonal and has a bottom plate part 2 and a side wall part 3 and houses an electronic component 5. The enclosure 1 includes screwing parts 7 extending outward from both sides of one side 1a of the outer periphery of the enclosure 1 and includes a columnar reinforcing part 4 which is provided along the side wall part 3 provided along one side 1a of the periphery and constituting the enclosure 1, from an inside center part of the side wall part 3 to an upper surface of the bottom plate part 2. Deformation of the side wall part 3 and the bottom plate part 2 can be suppressed by the reinforcing part 4. As a result, deformation of the package due to screwing can be suppressed.
申请公布号 JP2013172064(A) 申请公布日期 2013.09.02
申请号 JP20120036092 申请日期 2012.02.22
申请人 KYOCERA CORP 发明人 TANAKA NOBUYUKI;TAKAYA SHIGENORI
分类号 H01L23/02 主分类号 H01L23/02
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