发明名称 REPAIRING DEVICE AND REPAIRING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a repairing device and a repairing method capable of removing an electronic component from a circuit board while reducing a load on the circuit board.SOLUTION: A repairing device 1 includes: a solder fusing part 4 which has a first superheated steam generation part 16 for jetting superheated steam 14 to a soldered part of an electronic component 11 soldered to a circuit board 10 and fuses solder 15 by the superheated steam 14; and an electronic component removal part 5 which removes the electronic component 11 from the circuit board 10 in a state where the solder 15 is fused by the solder fusing part 4.
申请公布号 JP2013172029(A) 申请公布日期 2013.09.02
申请号 JP20120035435 申请日期 2012.02.21
申请人 KOKI TEC CORP 发明人 MORI EIJI
分类号 H05K3/34;B23K1/00;B23K1/012;B23K101/42 主分类号 H05K3/34
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