发明名称 GLASS SUBSTRATE WITH SEALING MATERIAL LAYER AND GLASS PACKAGE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a glass substrate with a sealing material layer capable of improving accuracy of laser sealing even when the thermal expansion coefficient of the glass substrate is high.SOLUTION: A glass substrate with a sealing material layer includes a sealing material layer on the glass substrate. The thermal expansion coefficient of the glass substrate is ≥70×10/°C in the temperature range of 30 to 380°C. The sealing material layer is the sintered body of a sealing material. The sealing material contains 55 to 95 volume% of bismuth-based glass and 5 to 45 volume% of a refractory filler, and is used for laser sealing.
申请公布号 JP2013170114(A) 申请公布日期 2013.09.02
申请号 JP20120036914 申请日期 2012.02.23
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 MASUDA NORIAKI;SHIRAGAMI TORU;ARAKAWA HIROSHI
分类号 C03C27/06;C03C8/24;C03C17/04;H01L31/04;H01M2/08;H01M14/00 主分类号 C03C27/06
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