发明名称 |
GLASS SUBSTRATE WITH SEALING MATERIAL LAYER AND GLASS PACKAGE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a glass substrate with a sealing material layer capable of improving accuracy of laser sealing even when the thermal expansion coefficient of the glass substrate is high.SOLUTION: A glass substrate with a sealing material layer includes a sealing material layer on the glass substrate. The thermal expansion coefficient of the glass substrate is ≥70×10/°C in the temperature range of 30 to 380°C. The sealing material layer is the sintered body of a sealing material. The sealing material contains 55 to 95 volume% of bismuth-based glass and 5 to 45 volume% of a refractory filler, and is used for laser sealing. |
申请公布号 |
JP2013170114(A) |
申请公布日期 |
2013.09.02 |
申请号 |
JP20120036914 |
申请日期 |
2012.02.23 |
申请人 |
NIPPON ELECTRIC GLASS CO LTD |
发明人 |
MASUDA NORIAKI;SHIRAGAMI TORU;ARAKAWA HIROSHI |
分类号 |
C03C27/06;C03C8/24;C03C17/04;H01L31/04;H01M2/08;H01M14/00 |
主分类号 |
C03C27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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