| 摘要 |
AN UPPER MOLD SECTION (2) AND A LOWER MOLD SECTION (3) ARE CLOSED WITH PRESCRIBED MOLD CLAMPING PRESSURE, FOR DIPPING SET OF ELECTRONIC COMPONENTS (5) MOUNTED ON A SUBSTRATE (6) INTO A RESIN MATERIAL (16) MELTED IN CAVITIES. A PRESSURIZING/DRIVING PORTION PRESSURIZES/DRIVES A PRESSURIZING MEMBER (13) TOWARD UPPER MOLD SECTION (2) WITH PRESCRIBED PRESSURIZING/DRIVING FORCE, SO THAT THIS PRESSURIZING/DRIVING FORCE IS TRANSMITTED TO CAVITY SIDE SURFACE MEMBERS THROUGH A FIRST ELASTIC MEMBER (14) AND A SECOND ELASTIC MEMBER (15) AND FORWARD END SURFACES (9A) OF CAVITY SIDE SURFACE MEMBERS (9) COME INTO CONTACT WITH A SURFACE (6A) OF SUBSTRATE (6). THE PRESSURIZING/DRIVING FORCE IS TRANSMITTED TO SECOND ELASTIC MEMBER (15), SO THAT THIS PRESSURIZING/DRIVING FORCE IS UNIFORMLY TRANSMITTED TO THE RESPECTIVE ONES OF CAVITY BOTTOM SURFACE MEMBERS (8) AND RESIN MATERIAL (16) HEATED AND MELTED IN RESPECTIVE CAVITIES (4) CAN BE UNIFORMLY PRESSED. |
