发明名称 Method for Packaging Thermal Interface Materials
摘要 A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.
申请公布号 US2013221014(A1) 申请公布日期 2013.08.29
申请号 US201313855268 申请日期 2013.04.02
申请人 THE BERGQUIST COMPANY;THE BERGQUIST COMPANY 发明人 JEWRAM RADESH;MCINTOSH WILLIAM E.;SCHMITZ JEREMY J.
分类号 B65D25/00 主分类号 B65D25/00
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