| 摘要 |
The invention relates to a method for producing a circuit board comprising the following steps: - providing at least one first element of the circuit board to be produced, more particularly a multilayer core element (31); - applying an adhesion-preventing material (39) to a region of the first element (31) to be subsequently exposed; - applying at least one additional layer (40, 41) to the first element (31); - connecting the first element (31) and the at least one additional layer (40, 41); and - removing a portion (44, 45) of the additional layer to expose the region of the first element, wherein in the additional layer corresponding to the portion to be subsequently removed, the material of the additional layer (40, 41) is cut through on at least one edge of the portion (44, 45) to be subsequently removed and the cut-through area (46, 47) is optionally filled with a different material from the material of the additional layer, before an application onto the first element (31) and/or a connection thereto is performed, so as to subsequently enable easy removal of the portion (44, 45) to be removed. |
