发明名称 |
Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same |
摘要 |
Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film. |
申请公布号 |
US2013220677(A1) |
申请公布日期 |
2013.08.29 |
申请号 |
US201313770225 |
申请日期 |
2013.02.19 |
申请人 |
HITACHI CABLE, LTD.;HITACHI CABLE FINE-TECH, LTD.;HITACHI CABLE FINE-TECH, LTD.;HITACHI CABLE, LTD. |
发明人 |
AMOU SATORU;ABE TOMIYA;SHANAI DAISUKE;KOMATSU HIROAKI;MURAKAMI KENICHI |
分类号 |
C09J181/06;B32B5/00;H05K1/02 |
主分类号 |
C09J181/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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