| 摘要 |
Embodiments disclosed herein include a method of manufacturing a multilayer wiring board that includes the steps of forming, on a support substrate, a laminate in which insulating layers and conductor layers are alternately laminated, accommodating a semiconductor chip in an opening of a prepreg which is formed on the surface of the laminate and that includes a sheet-like glass fiber impregnated with resin, and heating and pressurizing the surface of the prepreg in a state where the semiconductor chip is accommodated in the opening.
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