| 摘要 |
<p>A semiconductor wafer is adapted to support partial wafer processing generally transparently to a facility capable of processing a full wafer. The wafer has provided thereon a plurality of semiconductor dice and a plurality of visible reference features (11, 21 -23). The reference features are positioned among the dice to support a predetermined partitioning of the wafer into partial wafers (Q1 -Q4). The positioning of the reference features may render each partial wafer uniquely visually distinguishable from every other partial wafer. Each partial wafer may contain at least one of the reference features, with the position of each reference feature identified in accordance with a coordinate system of an electronic wafer map. The positioning of the reference features may provide a visual indication of where to cut the wafer to effect the partitioning.</p> |
