| 摘要 |
PURPOSE: An apparatus for plating a substrate is provided to evenly plate metal ion throughout the entire part of the substrate by spraying an electrolyte. CONSTITUTION: An apparatus (10) for plating a substrate comprises a process chamber (100), a target unit (110), and a plurality of electrolyte suppliers (120). The process chamber holds an electrolyte, and a chuck (160) for supporting the substrate installed in the chamber. The target unit is placed in the lower part of the process chamber, and generates metal ion when the anode voltage is applied. The electrolyte suppliers are separated and horizontally placed to each other, and supply the electrolyte to the process chamber. |
