| 摘要 |
PURPOSE: A semiconductor package with a micro electro-mechanical system is provided to obtain a white volume space which is a vibration sounding space of an MEMS chip as a flat substrate is applied to a ceramic substrate or a lead-frame substrate. CONSTITUTION: A semiconductor package comprises a ceramic substrate(100), a PCB substrate(120), a molding resin substrate(200), a lead-frame substrate, and an MEMS chip(600). The ceramic substrate and the PCB substrate are formed of a flat substrate or a cavity substrate. The molding resin substrate is composed of the cavity substrate. The lead frame substrate is electrically welded to the PCB substrate. The MEMS chip includes a membrane(602) formed on the flat substrate or the cavity substrate. |
