发明名称 |
Solid-state image pickup device and a camera module |
摘要 |
A solid-state image pickup device includes a solid-state image sensor chip having a solid-state image sensor having a photosensitive element formed on a main surface of a semiconductor substrate and chip electrodes led to the back surface of the semiconductor substrate, a passive chip bonded on the back surface of the solid-state image sensor chips having passive parts mounted in its thickness and electrically connected to the chip electrodes of the solid-state image sensors. The device further includes a lens holder fixed to enclose the photosensitive element of the solid-state image pickup sensor chip and a lens barrel to fit into the lens holders, wherein the passive chip is formed having a size equal to or smaller than a size of the solid-state image sensors.
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申请公布号 |
US8519457(B2) |
申请公布日期 |
2013.08.27 |
申请号 |
US201113116158 |
申请日期 |
2011.05.26 |
申请人 |
SEKINE HIROKAZU;ASHINO MASANORI;KABUSHIKI KAISHA TOSHIBA |
发明人 |
SEKINE HIROKAZU;ASHINO MASANORI |
分类号 |
H01L31/062;G02B7/02;H01L23/04;H01L27/14;H01L29/00;H01L31/113;H04N5/225 |
主分类号 |
H01L31/062 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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