发明名称 METHOD FOR MANUFACTURING MOS STRUCTURE
摘要 PROBLEM TO BE SOLVED: To allow for suppressing deterioration in interface characteristics in an interface between a compound semiconductor layer such as GaAs and an insulating layer in a state in which mass production is possible without using a large device.SOLUTION: In a step S101, a semiconductor layer composed of a compound semiconductor containing Ga and As is formed. In a step S102, a surface of the semiconductor layer is irradiated with a particle beam. In this particle beam irradiation, the surface of the semiconductor layer is irradiated with radicals of the atom selected from nitrogen, antimony, and phosphorus. In a step S103, an insulating layer is formed on the semiconductor layer irradiated with a particle beam.
申请公布号 JP2013165144(A) 申请公布日期 2013.08.22
申请号 JP20120026957 申请日期 2012.02.10
申请人 NIPPON TELEGR & TELEPH CORP <NTT>;TOKYO INSTITUTE OF TECHNOLOGY 发明人 HARADA YUICHI;TOKUMITSU EISUKE
分类号 H01L21/324;H01L21/336;H01L21/822;H01L27/04;H01L29/78 主分类号 H01L21/324
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