发明名称 |
ADHESIVE SHEET FOR DICING |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing which attains adhesiveness with a substrate and loss prevention of laser printing on the surface of the substrate after the adhesive sheet has been peeled.SOLUTION: The adhesive sheet for dicing includes an adhesive layer and a substrate layer. The adhesive layer contains a polyolefin-based resin, and an adhesive force of the adhesive layer to a semiconductor mirror wafer is 1.0 N/20 mm or more. |
申请公布号 |
JP2013165206(A) |
申请公布日期 |
2013.08.22 |
申请号 |
JP20120028062 |
申请日期 |
2012.02.13 |
申请人 |
NITTO DENKO CORP |
发明人 |
HIGASHIBEPPU YUKI;HABU TSUYOSHI;KAMEI KATSUTOSHI |
分类号 |
H01L21/301;C09J7/02;C09J123/00;C09J123/14 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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