发明名称 ADHESIVE SHEET FOR DICING
摘要 PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing which attains adhesiveness with a substrate and loss prevention of laser printing on the surface of the substrate after the adhesive sheet has been peeled.SOLUTION: The adhesive sheet for dicing includes an adhesive layer and a substrate layer. The adhesive layer contains a polyolefin-based resin, and an adhesive force of the adhesive layer to a semiconductor mirror wafer is 1.0 N/20 mm or more.
申请公布号 JP2013165206(A) 申请公布日期 2013.08.22
申请号 JP20120028062 申请日期 2012.02.13
申请人 NITTO DENKO CORP 发明人 HIGASHIBEPPU YUKI;HABU TSUYOSHI;KAMEI KATSUTOSHI
分类号 H01L21/301;C09J7/02;C09J123/00;C09J123/14 主分类号 H01L21/301
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