| 摘要 |
An electronic apparatus includes a chassis and a heat dissipation module. The chassis includes a first panel, a second panel substantially parallel to the first panel, and a motherboard attached on the first panel and located between the first panel and the second panel. The heat dissipation module is attached on the motherboard and includes a fan with a cover, a first fin assembly attached to a first side of the fan, and a second fin assembly attached to a second side of the fan. The cover includes a main plate with an opening and a resisting flange extending slantwise from an edge of the opening. A portion of the first fin assembly is exposed by the opening. The resisting flange resists against the second panel to keep the main plate away from the second panel.
|
