发明名称 PEELING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a peeling device having a suitable configuration in terms of inner-device space effective utilization.SOLUTION: A cutting device includes: a cutting component 30 having a pair of blade parts 31; a cutting drive mechanism for performing a cutting operation that allows the cutting component 30 to move toward the cutting direction X1 until a wire peeling target area fits into a cutting gap 32 formed between the pair of blade parts 31, and a returning operation that allows the cutting component 30 to move toward the returning direction Y1; a wire move regulation mechanism for regulating the movement of the peeling target area by allowing a returning direction side contact part 70 and a cutting direction side contact part 50 to sandwich the peeling target area. The returning side contact part 70 includes a penetration part 73 for penetrating in a reciprocation direction A1 of the cutting component 30 at each of both sides sandwiching a wire central part in the wire width direction W1. Each of the penetration parts 73 has a width of extension direction L larger than the blade part 31, and an opening opposite to the wire central part side in the wire width direction W1.
申请公布号 JP2013165582(A) 申请公布日期 2013.08.22
申请号 JP20120027531 申请日期 2012.02.10
申请人 AISIN AW CO LTD 发明人 ICHIKAWA HIRONARI;SUGIMOTO TAKAMITSU;TACHIKI TSUNETOSHI
分类号 H02G1/12;B23D79/12 主分类号 H02G1/12
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