发明名称 |
Interposer Having Conductive Posts |
摘要 |
There are disclosed herein various implementations of an interposer for use in semiconductor packaging. One exemplary implementation comprises a conductive post formed from a wire bond. A first end of the conductive post is mechanically joined to a conductive pad on a first surface of the interposer, while a second end of the conductive post is capable of making electrical connection to a contact body on an active surface of a semiconductor die. Such an interposer may include a rigid or flexible interposer dielectric. In one exemplary implementation, the interposer dielectric has a via formed therein, the conductive post being situated in the via and extending through a second surface of the interposer opposite the first surface. |
申请公布号 |
US2013214408(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201213401077 |
申请日期 |
2012.02.21 |
申请人 |
ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN;BROADCOM CORPORATION |
发明人 |
ZHAO SAM ZIQUN;KHAN REZAUR RAHMAN |
分类号 |
H01L23/498;B23K31/02;H05K1/09;H05K1/11 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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