COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

摘要

A component mounting device in which a large number of component types can be mounted at a high throughput using a single mounting unit. According to a representative embodiment of the present invention, the component mounting device has a plurality of component handover tables between the component supply unit and the printed substrate transportation path, and further has: a plurality of component extraction heads capable of moving above a region including the component supply unit and the component handover tables; and component mounting heads capable of moving above a region including the component handover tables and the printed substrate transportation path without intersecting each other, the number of the component mounting heads being identical to that of the component handover tables. Each of the component extraction heads extracts a necessary component from the component supply unit and places the component on the predetermined component handover table. Each of the component mounting heads acquires the component placed on the corresponding component handover table and mounts the component at the predetermined position on the printed substrate.