发明名称 |
LED PACKAGING STRUCTURE HAVING IMPROVED THERMAL DISSIPATION AND MECHANICAL STRENGTH |
摘要 |
The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
|
申请公布号 |
US2013215613(A1) |
申请公布日期 |
2013.08.22 |
申请号 |
US201213399027 |
申请日期 |
2012.02.17 |
申请人 |
WU YI-TSUO;TSMC SOLID STATE LIGHTING LTD. |
发明人 |
WU YI-TSUO |
分类号 |
F21V29/00;F21V17/12;F21V21/00;F21V25/00 |
主分类号 |
F21V29/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|