| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that when a piezoelectric element, for example, is used as a vibration element for dust removal and the piezoelectric element is bonded to the imaging element side of an optical element, a thickness of an imaging unit is reduced, however, dust resistance is deteriorated in a space between the optical element and an imaging element due to wiring being led out from the piezoelectric element.SOLUTION: An imaging unit includes: an imaging element converting an optical image into an electric signal; an optical member disposed on a front surface of the imaging element and allowing the optical image to transmit; a rubber member held by the imaging element and the optical member; and a vibration element vibrating the optical member. The rubber member has a conductive part, connecting a circuit board vibrating the vibration element with the vibration element, in at least a part thereof. |
