METHOD FOR POLISHING BOTH SURFACES OF WAFER

摘要

The present invention is a method for polishing both surfaces of a wafer in which: a wafer is held in a holding hole of a carrier; said held wafer is placed between upper and lower surface plates on which polishing cloths have been affixed; the carrier is rotated and revolved to polish both surfaces of the wafer simultaneously; and said wafer-polishing is repeated in batches. The method for polishing both surfaces of a wafer is characterized in that during the wafer-polishing that is repeated in batches, the direction in which the carrier is revolved is switched to the opposite direction with each batch, thereby providing a method for polishing both surfaces of a wafer that limits the reduction in productivity due to dressing while allowing wafers of a high degree of flatness to be stably obtained.