| 摘要 |
<p>The purpose of the present invention is to provide a multilayer printed wiring board having a partial through-hole formed by dividing a through-hole, in which the partial through-hole can be formed readily and accurately on the basis of an intended design. A multilayer printed wiring board comprising electrically conductive layers each having a circuit pattern formed thereon and insulating layers, wherein the electrically conductive layers and the insulating layers are laminated in an alternating sequence and the electrically conductive layers are electrically connected to each other through a through-hole, said multilayer printed wiring board being characterized in that the through-hole comprises a plating resist part that is arranged between one of the electrically conductive layers and one of the insulating layers both of which are exposed to an opening of a through-hole and/or between the insulating layers and a plated part that is formed in an exposed region other than the plating resist part, wherein the plating resist part is formed by a cured product of a plating resist resin composition comprising an epoxy resin, an isocyanate compound and a non-electrically-conductive filler.</p> |
