METHOD FOR MANUFACTURING CARRIER MEMBER AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a carrier member and a method for manufacturing a printed circuit board using the same which prevent a stripping phenomenon of an isolation layer caused by influence of physical shocks, chemicals or the like during substrate manufacturing processes.SOLUTION: The method for manufacturing a carrier member includes: preparing an insulating material; preparing at least one metal plate in which a first metal plate and a second metal plate on the first metal plate are formed; laminating the at least one metal plate on an upper surface and/or a lower surface of the insulating material such that the first metal plate is in contact with a surface of the insulating material; and removing an outer edge of the second metal plate so as to expose an outer edge of the first metal plate of the metal plate.