发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a die bonding technique capable of dispensing die bonding paste at a stable application amount. <P>SOLUTION: A dispenser for dispensing die bonding paste has a seal disk 51. The seal disk 51 has an intake groove 54 connected to an intake hole 52 and a delivery groove 55 connected to a delivery hole 53 on the upper surface thereof, and the intake groove 54 is formed so as to surround the entire periphery of the delivery groove 55 on the upper surface of the seal disk 51. A failure that leads to the leakage of paste into a sliding surface between a valve disk and a seal disk 51 can be suppressed by fixing the seal disk 51 to the dispenser, so that variations in the application amount of paste supplied to a packaging base can be suppressed. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5271972(B2) 申请公布日期 2013.08.21
申请号 JP20100140402 申请日期 2010.06.21
申请人 发明人
分类号 H01L21/52;H01L21/301;H01L21/67;H01L21/683 主分类号 H01L21/52
代理机构 代理人
主权项
地址