CONDUCTIVE PARTICLES, MANUFACTURING METHOD OF THE SAME, AND CONDUCTIVE MATERIALS INCLUDING THE SAME

摘要

PURPOSE: A conducting particle is provided to prevent the malfunction of a circuit due to the sudden increase of resistance and the connection failure of the circuit by controlling fracture strain and compression strain when an external force is applied to the conducting particle. CONSTITUTION: A conducting particle has a resin particle and a coating layer which is located on the resin particle and has protrusions on the surface thereof. The conducting particle satisfies formula 1: 20 <=(Sf/Sc)/D *100 <=50. In the formula 1, Sf represents a strain (micron) when a force (F2, mN) initiating the fracture of the conducting particle is applied; Sc is a strain (micron) when a force (F1, mN) same as the diameter of the conducting particle is applied; and D is the average particle diameter (micron) of the conducting particle. The thickness of the coating layer is 30-300 nm and the height of the protrusion is 50-500 nm. [Reference numerals] (AA) Fracture starting point; (BB) Compression deformation (S_c); (CC) Fracture deformation (S_f); (F1) Compression deformation Load (mN); (F2) Fracture deformation load (mN)