SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to obtain a thin and small semiconductor device by forming a vertical lamination structure consisting of semiconductor chips. CONSTITUTION: An insulating material layer (4) encapsulates semiconductor devices (2b). A metal thin film wiring layer (6) is formed in the insulating material layer. A part of the metal thin film wiring layer is exposed to an outer surface. The electrode pads of the semiconductor devices are electrically connected to the metal thin film wiring layer. [Reference numerals] (AA) Semiconductor device A