| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic device which secures good solderability of a terminal and achieves smooth insertion of the terminal into a through hole.SOLUTION: Multiple through holes 5, through which terminals 4 of a device body 11 penetrate, are provided on a printed wiring board 2 so as to be respectively positioned near multiple lands 3. The multiple terminals 4 provided at the device body 11 respectively have lengths that enable the multiple terminals 4 to penetrate through the through holes 5 and protrude a predetermined amount thereof from a surface 2a of the printed wiring board 2. Extension parts 4b of the terminals 4 which protrude from the through holes 5 are disposed so as to face the land parts 3, and the land parts 3 and the extension parts 4b of the terminals 4 are soldered in a surface mounting manner. |
