发明名称 WINDING HOLDING STRUCTURE IN SPOOL WINDING OF BONDING WIRE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To prevent the breakage of winding of the bonding wire completely in spite of vibration or impact during transportation or storage of the spool winding by covering a peripheral surface of the spool winding with a thin film having soft elasticity softly so as to hold it elastically, thereby restraining the movement in a winding-width direction completely. CONSTITUTION:A spool 1 has a multiplayer form in which a bnding wire 2 is wound with crossing at a constant pace. The whole periphery of the spool winding 3 is covered with a sheet 6 provided with a tape 4 for cutting which is arranged so as to cross the spool and to project from the side of the spool, at an end portion of the sheet 6 and with a thin film having a soft elasticity, i.e. a urethane resin film 5 comprising extremely minute bubbles, on the inner surface. The tape 4 for cutting wraps an outer surface of another end portion of the sheet 6 and one end is stuck to, thereby holding the winding 3.
申请公布号 JPS59189639(A) 申请公布日期 1984.10.27
申请号 JP19830065121 申请日期 1983.04.13
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 TATSUMOTO HIDEHISA
分类号 B65H75/02;B65H75/14;B65H75/18;H01L21/60 主分类号 B65H75/02
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