BASE MATERIAL FOR PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a base material for a printed wiring board which is manufactured without using a vacuum facility and where an insulation base material and a conductive layer adhere to each other, and to provide a manufacturing method of the base material for the printed wiring board.SOLUTION: A base material for a printed wiring board comprises: an insulation base material; a first conductive layer; and a second conductive layer. In a manufacturing method of the base material for the printed wiring board, a metal layer serving as the first conductive layer is formed on a surface of the insulation base material with the insulation base material immersed in a metal reduction solution containing metal ions and a reductant reducing the metal ions. Next, the second conductive layer is formed on the first conductive layer by electric plating.