| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method of a device wafer capable of reducing deposits adhering to the device surface.SOLUTION: The cutting method is to cut a device wafer along scheduled dividing lines with a cutting blade, and the device wafer is where devices are formed, respectively, in the regions sectioned by a plurality of intersecting scheduled dividing lines formed on the surface includes a step for rendering the surface of the device wafer hydrophilic by irradiating with plasma, and a step for cutting the device wafer along the scheduled dividing lines with a cutting blade while supplying a cutting fluid. |
