发明名称 LED PACKAGE AND LED PACKAGING FRAME
摘要 PROBLEM TO BE SOLVED: To provide an LED package and an LED packaging frame capable of ensuring adhesion between a lead frame and a package (particularly, in an insulation part insulating between two lead frames) with a simple structure to thereby increase the performance and the reliability of the LED package.SOLUTION: An LED package includes: an LED element 110; plural lead frames 101 and 102 having one surface on which the LED element 110 is mounted and the other surface; and an insulation part 103a for insulating between the plural lead frames 101 and 102. The lead frames 101 and 102 include a concave portion in an end portion at the insulation part 103a where one side face and plural lead frames face each other, and the insulation part 103a sandwiches the concave portion and the other surface of the lead frames 101 and 102.
申请公布号 JP2013161841(A) 申请公布日期 2013.08.19
申请号 JP20120020568 申请日期 2012.02.02
申请人 PANASONIC CORP 发明人 TOYODA HIDEKI;UTSUNOMIYA WATARU;INOUE HIDEFUMI;SEKI NORIAKI;SHUDO SHINJI
分类号 H01L33/62;H01L23/48 主分类号 H01L33/62
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