METHOD FOR MANUFACTURING GLASS SUBSTRATE, METHOD FOR MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT, AND RADIO-CONTROLLED CLOCK

摘要

PROBLEM TO BE SOLVED: To improve glass frit adhesion in an interface between an inner wall surface of a through hole of a glass substrate and a glass frit filled in the through hole.SOLUTION: A method for manufacturing a glass substrate having a through hole penetrating a base substrate composed of a glass material in a thickness direction comprises: a step S37 of filling a glass frit between a through hole for fixing a metal pin inserted into the through hole penetrating the base substrate in the thickness direction and the metal pin (filling step); and a step S35 of cleaning the base substrate with a hydrofluoric acid (through hole cleaning step). The through hole cleaning step is performed before the filling step.