CONTACT PIN, AND THE SOCKET FOR TEST OF SEMICONDUCTOR PACKAGE COMPRISING THE SAME

摘要

PURPOSE: A contact pin and a socket including the same for semiconductor testing are provided to improve a contacting property by providing multipoint contact. CONSTITUTION: A contact pin comprises an upper terminal (30) providing a multipoint contact (31), and an elastic part (33) and a lower terminal (34). The upper terminal is mounted at a socket for semiconductor package testing and forms a point of contact with a semiconductor package terminal. An elastic part is extended to a lower direction from one lower side part of the upper terminal and formed of one line alternately having ridges and valleys. A lower terminal is extended to a lower direction from one lower side part of the elastic part.