METHOD AND DEVICE FOR CONVEYING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and a device for conveying a substrate in which a substrate in a heated state is efficiently conveyed to a predetermined table without being damaged.SOLUTION: A wafer formed by molding a plurality of chips aligned and arranged in a plane with a resin is used as a work-piece by being stuck to a support plate via a double-sided adhesive tape provided with an adhesive layer having thermal exfoliation on one side. After a desired treatment is applied to the work-piece, the work-piece is heated on a first table 21 in order to separate the support plate by a support plate separation device. After being separated from the double-sided adhesive tape, the resin of the wafer is in a softened state and the wafer is conveyed while absorbing and holding the whole area on the resin side of the wafer by a suction plate 35.