发明名称 THERMALLY CONDUCTIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive sheet excellent in thermal resistance, moldability, and thermal conductivity.SOLUTION: The thermally conductive sheet 1 includes a boron nitride particle 2, an epoxy resin and a curing agent, the epoxy resin includes a crystalline bisphenol type epoxy resin, and the curing agent includes a phenol resin containing a partial structure represented by formula (1).
申请公布号 JP2013159759(A) 申请公布日期 2013.08.19
申请号 JP20120025345 申请日期 2012.02.08
申请人 NITTO DENKO CORP 发明人 IZUMITANI SEIJI;YAMAGUCHI MIHO;HIRANO KEISUKE
分类号 C08G59/62;C08K3/38;C08L63/00;C08L63/02;C09K5/08 主分类号 C08G59/62
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