| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric vibration piece for suppressing a mask material from being adhered to a lower surface of a wafer to suppress unevenness of film thickness when a mask material film is formed on the wafer by capturing the mask material before the mask material sneaks downward of the wafer.SOLUTION: A method for manufacturing a piezoelectric vibration piece for manufacturing a piezoelectric vibration piece from a wafer includes a mask material film formation process of forming a mask material film which becomes a mask in formation of the outer shape of a piezoelectric vibration piece by a spin coat method on a first surface 65a of the wafer 65. The mask material film formation process is performed by holding the wafer 65 by making a second surface 65b downward on an upper surface of a wafer holding part 72 of a spin chuck 70, arranging a current plate 88 which projects outside the outer edge 66 of the wafer 65 at a lower part of the wafer holding part 72, providing a first rod-like member 90 which extends in the vertical direction at a position outside the outer edge 66 of the wafer 65, and rotating the wafer 65 by the spin chuck 70. |
