| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device that is made compact and increased in manufacturing yield by preventing a package from being broken in a manufacturing process therefor, and an electronic apparatus including the same.SOLUTION: An electronic device (piezoelectric device 10) includes a package 12 having a first recessed part 16 in which an electronic component (piezoelectric vibration chip 72) is housed and a second recessed part 60 sharing a bottom part of the first recessed part 16 and opened to the opposite direction from the first recessed part 16, and a lid 84G sealing the opening part of the first recessed part 16, and is characterized in that an inner wall surface of the second recessed part 60 includes a groove 66 which partially extends along a depth of the second recessed part 60 and is arcuate in plane view, and the groove 66 is filled with metal bodies 68E and 68F. |
