| 摘要 |
PROBLEM TO BE SOLVED: To prevent a tripod installation part from being heated and causing a user to feel discomfort without increasing the number of components and enlarging an imaging apparatus when heat generated in a circuit element mounted on a substrate disposed on the rear surface side of the imaging apparatus is transmitted to a front cover through a lower housing having the tripod installation part.SOLUTION: An imaging apparatus includes: a front cover that is a resin mold component; a substrate unit where electronic components are mounted; and a lower housing which has a tripod installation part and is made of a metal. In the imaging apparatus, the substrate unit is connected with the lower housing by a first heat conductive member and the lower housing is connected with the front cover by a second heat conductive member. The first and second heat conductive members are set so that heat resistance of the lower housing and the front cover becomes smaller than heat resistance of the substrate unit and the lower housing. |
