SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a method for manufacturing the same are provided to prevent the damage of a chip pad by decreasing physical pressure and energy applied to the chip pad. CONSTITUTION: A semiconductor chip (110-140) is mounted on a substrate. The semiconductor chip includes a chip pad. A bump (152,154,156,158) is formed on the chip pad. A wire (170) is formed between the chip pad and the bump. The wire electrically connects the chip pad and a substrate pad.